Silicon Catalyst adds RED Semi, five others to incubator
Silicon Catalyst has added UK processor IP designer RED Semiconductor to its semiconductor startup incubator alongside five North American companies.
Silicon Catalyst is the only incubator and accelerator focused on the global semiconductor industry and has 24 companies in the programme in the US, UK and Europe.
RED Semiconductor was founded in 2021 to deliver microprocessor performance gains through its semiconductor core IP called VISC (Versatile Intrinsic Structured Computing). VISC is compatible with the standard RISC-V ISA and uses a compression and sequencing technology to enable entire algorithmic routines to be optimised for parallel execution. This can be used in chip from embedded microcontrollers to high-performance computing.
“VISC is a RISC-V-based approach that radically streamlines algorithmic processing to deliver faster, smaller, and lower power edge AI solutions,” said James Lewis, CEO of RED Semi (above). “VISC delivers the performance benefits of dedicated hardware accelerators with the versatility of a general-purpose microprocessor. For SoC developers, it enables multiple heterogeneous compute functions to be accomplished with a unified instruction set and hardware core.”
The company was previously selected for the first cohort of ChipStart UK, the startup incubator run by Silicon Catalyst and funded by the UK government.
“Our recently concluded applicant screening cycle included a record number of early-stage companies looking to join our 24-month incubation program,” said Pete Rodriguez, CEO of Silicon Catalyst. “These six companies are working on developing and delivering transformative innovations across a diverse range of technologies to address their target markets. Our Partners and the members of our comprehensive Silicon Catalyst ecosystem are looking forward to assisting these companies on their journey to market success.”
35Elements in Illinois is developing a green light emitting diode (LED) technology based on its core gallium nitride (GaN) technology for advanced photonics and electronics applications such as augmented and virtual reality displays, digital lighting, optical interconnects, wide bandgap complementary logic functions and power electronics.
CrossFire Tech has developed connectivity IP for chiplets without using interposers, enabling wafer scale ‘MegaChips’. The Bridgelets and related IP allow up to a 50x reduction in Die-to-Die interface area with a per bit energy transfer metric of <0.025pJ / bit – lower than even some monolithic on die implementations.
Edgewater Wireless in Canada develops WiFi silicon for residential and commercial markets using spectrum slicing.
Jmem Tek in Taiwan and California has launched the world’s first PUF Based Post-Quantum Cryptography (PQC) Chip. The company specializes in hardware security IP and provides IC design services for next-generation hardware security.
WaveWorks in Washington state has developed backscatter technology that lets wireless devices send more data for less power than any conventional radio solution, breaking battery barriers for wireless sensors and peripherals for the Industrial Internet of Things (IIoT), mobile peripherals, wearables, and VR/AR/MR.
The Silicon Catalyst Incubator is currently accepting applications to the 24-month program with an application deadline of January 17th, 2025
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