Single chip for EV battery junction box designs
NXP Semiconductors has developed a battery junction box chip that integrates multiple pack monitoring, control and actuator functions.
The NXP MC33777 is the world’s first battery junction box integrated circuit to integrate sensing, cell management and a pyrotechnic fuse controller in a single device. Consolidating essential battery management system (BMS) functions in a single chip simplifies the design and development of junction boxes for EVs such as those developed by Volkswagen.
This helps protect high-voltage batteries from overcurrent by constantly monitoring the battery current and slope every eight microseconds. It detects and reacts to a wide matrix of configurable events up to 10 times faster than conventional ICs, for example, without waiting for specific current thresholds to be exceeded.
The MC33777 reduces the component count by up to 80%, limiting required printed circuit board (PCB) space and reducing software development effort due to hardware implementations.
The device can drive two pyrotechnic switches independently and includes an extensive set of diagnostics for ASIL D safety levels.
The device measures redundantly currents, voltages, and temperatures. It processes the results and detects fault events such as short circuits, system overloads or crash signals. These events can be combined and used to trigger reactions without a microcontroller via the GPIOs, or pyrotechnic switch.
It uses an isolated daisy chain (TPL3) or a Serial Peripheral Interface (SPI) for communication with the MCU
“Integrating everything that’s required to monitor a battery pack and react quickly to safety-critical events into a single device delivers significant benefits for both OEMs and the end consumer. NXP’s MC33777 marks a new generation of battery junction box ICs for electric vehicles, delivering faster, safer and more affordable management solutions for high-voltage battery packs,” said Jesus Ruiz Sevillano, Director of Product Marketing BMS at NXP.
The MC33777 device family will make its debut at Electronica 2024. Additional details on the MC33777 IC can be found on the NXP website at nxp.com/MC33777.
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