MENU

Top articles in March

Top articles in March

Feature articles |
By Nick Flaherty



The top articles in March on EeNews Europe covered a wide range of topics, from the latest developments at Raspberry Pi through China’s lithography business and even a discrete p-channel MOSFET.

Raspberry PI is planning to add 2MB of flash into its package alongside its new RP2350 microcontroller for an extra 20 cents, which shows the challenges for the memory business! This will help reduce the size and complexity of embedded systems.

At the same time the company is redesigning its add on board for Power over Ethernet to accommodate its latest Raspberry Pi 5 board, eliminating the need for a power supply by taking power from the Ethernet connection.

Raspberry Pi adds 2MB stacked flash for 20¢ in RP2354

Raspberry Pi redesigns Power over Ethernet for the Pi 5

Microchip’s latest low cost in-circuit debugger was also popular, tapping into USB-C connectivity for just $30.

Microchip releases cost-effective in-circuit debugger

The future of Intel will be a continuing theme through this year, not least as it brings 3nm technology to Europe at its fab in Ireland. But it was the differences between former CEO Pat Gelsinger and board member Lip-bu Tan that was very interesting, especially with Tan appointed as CEO earlier this month.

Lip-Bu Tan quit Intel board after ‘differences’ with CEO, says Reuters

The move to true terahertz wireless systems is enabled by a key move to single chip implementation at ETH Zurich. A single chip that can operate all the way from 10MHz to 1.1THz will be developed by spin out company Polariton Technologies for a wide range of applications.

Single chip modulator from 10MHz to 1THz

Swedish industrial group Mycronic is set to become more influential as its adds MRAM magnetic memory  technology to its range of industrial equipment for printed circuit board assembly and test, die bonding and photonic interconnect. The acquisition of Hprobe in France highlights the maturing of MRAM technology into wider applications that need assembly and test expertise.   

Mycronic moves into semiconductors with French MRAM buy

And then there is China. Sanctions have looked to restrict the shipment of the latest lithography equipment using extreme ultraviolet (EUV) and deep UV (DUV) technologies. The country is now set to trial its own EUV technology later in the year and researchers have developed a solid state DUV system.

China-developed EUV lithography could trial in 2025

China details solid state DUV lithography system

One of the key questions of the month was the distinction between a backdoor vulnerability in a chip and undocumented debug instructions. Researchers in Spain found undocumented instruction in older ESP32 WiFi chips from Espressif, which could technically be exploited. Espressif has issues patch to address the issue and points out that this doesn’t apply to its later cores.

Backdoor in Espressif Bluetooth microcontroller – update

But it is a lowly single transistor that was the most read article in March on eeNews Europe. The space industry is a significant and growing opportunity for Europe, and the first discrete p-channel MOSFET for space applications launched by Infineon Technologies is a key enabler for those power systems.

Infineon launches its first P-channel MOSFET for space

Related articles 

If you enjoyed this article, you will like the following ones: don't miss them by subscribing to :    eeNews on Google News

Share:

Linked Articles
10s