TSMC, Amkor to bring advanced packaging to Arizona

News | October 7, 2024

By Peter Clarke

foundry Advanced Packaging

Chip packaging company Amkor Technology Inc. (Tempe, Arizona) and foundry TSMC has agreed to collaborate on bringing TSMC’s InFO and CoWoS advanced packaging and test to Arizona.

The two companies have signed a memorandum of understanding that covers TSMC sub-contracting certain advanced packaging and test services from Amkor in their planned facility in Peoria, Arizona. Collaboration was expected as Amkor has lined up TSMC customer Apple to be the first and largest customer for the Arizona facility.

Amkor, Apple plan for chip packaging plant in Arizona

What remains unclear is how proprietary TSMC packaging techniques will be handed off to Amkor. The packaging facility is expected to begin operations within a couple of years.

Amkor said TSMC will make use of its services to support its customers, particularly those using TSMC’s advanced wafer fabrication facilities in Phoenix. The proximity of TSMC’s front-end fab and Amkor’s back-end facility will accelerate product cycle times. The collaboration will include TSMC’s Integrated Fan-Out (InFO) and Chip on Wafer on Substrate (CoWoS) technologies to address common customers’ needs, the two companies said.

“This expanded partnership underscores our commitment to driving innovation and advancing semiconductor technology while ensuring resilient supply chains,” said Giel Rutten, CEO of Amkor, in a statement.

“Our customers are increasingly depending on advanced packaging technologies for their breakthroughs in advanced mobile applications, artificial intelligence and high-performance computing, and TSMC is pleased to work side by side with a trusted long-time strategic partner in Amkor to support them with a more diverse manufacturing footprint,” said TSMC senior vice president Kevin Zhang, in the same statement. “We look forward to close collaboration with Amkor at their Peoria facility to maximize the value of our fabs in Phoenix and provide more comprehensive services to our customers in the United States.”