AT&S is to invest €500m in a new R&D center for substrate and packaging solutions for the global semiconductor industry at its location in Leoben-Hinterberg in Austria.
This will include a technology upgrade of the production facilities over the next four years and a new office building, with 700 new staff.
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AT&S is aiming for the project to be part of the European Chip Act, announced by Ursula von der Leyen, President of the European Commission, in mid-September. The goal is to jointly create a European state-of-the-art chip ecosystem in order to safeguard security of supply in Europe and to develop new market for European breakthrough technologies.
“Leoben is the central hub of AT&S. Starting here, AT&S has grown to become a global group and today is one of the key players in the high-end printed circuit board and IC substrate business,” says Hannes Androsch, Chairman of the AT&S Supervisory Board.
“While we invest heavily in other countries and only recently announced our new location in Kulim/Malaysia, it is exactly these investments in Asia that not only secure our locations and their employees, but also ensure that the site in Leoben is expanded and around 700 highly qualified jobs are being created.”
Precursors for IC substrates are produced in Leoben and then processed into final products at the facilities in Chongqing/China and in the future also in Kulim/Malaysia. To meet the growing demand, the production facilities are upgraded and an additional production building of roughly 18,000 m 2 will be built. The research centre will include production of small series and prototypes.
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“The technologies used here are unparalleled in Europe and give AT&S a unique selling proposition on the market,” said