Nano Dimension launches DragonFly IV 3D-printer, acquires Swiss PCB maker

November 16, 2021 // By Nick Flaherty
Nano Dimension launches DragonFly IV 3D-printer, acquires Swiss PCB maker
Nano Dimension to combine its DragonFly IV 3D printing system for performance embedded electronic devices with Essemtec PCB manufacturing technology

Nano Dimension has launched its latest high precision 3D printing system and software to embed electronics into 3D structures and printed circuit boards.

The DragonFly IV printer and FLIGHT software platform deposits proprietary dielectric and conducting materials simultaneously, while concurrently integrating in-situ capacitors, antennas, coils, transformers, and electro-mechanical components.

The system was launched at the Productronica tradeshow today and with the recent $24m acquisition of Essemtec in Lucerne, Switzerland opens up the ability to embed functional chips into 3D structures.

“Essemtec’s present products fit Nano Dimension’s PCB and PCB assembly markets, as well as the Original Equipment Manufacturers (OEM) verticals which we serve. Our mutual vision is to merge the technologies of our micro-electronic 3D-fabrication machines with Essemtec’s fuller suite of in-fabrication-process-equipment-assembly capabilities,” said Yoav Stern, Chairman and Chief Executive Officer of Nano Dimension.

Essemtec has developed adaptive, highly flexible surface mount technology (SMT) pick-and-place equipment with a dispenser suitable for both high-speed and micro-dispensing,and intelligent production material storage and logistic system. Its products are equipped with a sophisticated software package which makes extensive and efficient material management possible.

“No less important is our intention to use our newly acquired deep learning based artificial intelligence technologies from our DeepCube acquisition to become the “robotic brains” for Essemtec systems,” he said. “Essemtec’s machines fit the larger picture of Nano Dimension’s vision, aiming to establish Industry 4.0 solutions, which entail building an artificial intelligence “distributed digital manufacturing application” rather than just machines as capital equipment.

“The end goal is to reach a capability for maintaining an inventory of high-end PCB devices, micro-mechanical parts and Hi-PEDs in digital form: print and assemble them as you need them, where you need them, only the quantity you need, in the best quality at competitive prices, as it is done in highest yield and throughput possible for that point in time, specifically in high mix/low volume scenarios.”

Next: Prototype systems

The launch of the DragonFly IV at Productronica

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