Canon fields lithography stepper for 3D packaging

Canon fields lithography stepper for 3D packaging

Technology News |
By Peter Clarke

Canon Inc. has launched an i-line lithography stepper for use in 3D advanced packaging such as those used with chiplets mounted on an interposer.

The FPA-5520iV LF2, based on 365nm wavelength light, is optimized for back-end processing and offers 0.8 micron resolution across a single-exposure field of 52mm by 68mm single-exposure field. A four-shot mode extends the field to 100mm by 100mm, the company said.

The FPA-5520iV LF2 reduces distortion aberration to less than 25 percent of its predecessor model, released in April 2021, and features a projection optical system with greater light level uniformity.

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