DNP develops photomask process for 3nm EUV litho
Dai Nippon Printing Co. Ltd. (Tokyo, Japan) has developed a photomask manufacturing process capable of accommodating the 3nm lithography process that supports extreme ultraviolet (EUV) lithography.
DNP was the first merchant photomask manufacturer to introduce the multi-beam mask writing (MBMW) tool which uses approximately 260,000 electron beams to write a mask and shortened the mask preparation time. This was applied to the creation of photomasks for 5nm in 2020.
DNP is engaging in joint development of EUV photomasks with IMEC research institute for next-generation processes at 2nm and beyond and DNP has installed an additional MBMW tool and plans to start using it in 2H24.
EUV already in use for logic processes at 7nm and below is now being adopted by memory chip makers and is indispensable in the supply of cutting-edge semiconductors.
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