DNP improves chip packages with glass-cored substrate
Dai Nippon Printing Co. Ltd. has developed a glass-based substrate that is claims is an improvement on resin-based substrates such as flip-chip ball-grid-array (FC-BGA).
The company has developed a technique called through-glass-via (TGV) to provide a higher performance package based on glass. DNP said that by adapting its display panel manufacturing process, its Glass-Core Substrate (GCS) is able to provide larger substrates.
X-ray image of TGV in the glass core substrate. Source: DNP.
The GCS is a conformal type glass substrate in which a metal layer is adhered to the side walls of the via which are then filled with copper. DNP has a proprietary manufacturing method that is claims enhances the adhesion between glass and metal – conventionally difficult to achieve – to realize fine pitch and high reliability.
The GCS supports TGV aspect rations of more than 9:1. As there are few restrictions regarding the thickness of the glass substrate used, it is possible to boost the degree of freedom when designing for warpage, rigidity, and flatness.
DNP said it is promoting the use of a panel size of 510mm by 515mm and is aiming for sales of 5 billion yen (about US$38 million) in the 2027 financial year.
Related links and articles:
News articles:
Universal memory startup formed in the UK
Startup Chipletz selects Siemens EDA
CEO interview: Alphawave IP’s Pialis on chiplets and custom silicon
Chiplet opportunity prompts Alphawave to buy SiFive design arm for $210 million
5nm processor for wearables made with EUV and chiplets
