High density power module for edge AI
Microchip Technology has developed a fully integrated point-of-load 12A power module with a 16V VIN buck converter and support for I2C and PMBus interfaces for edge AI designs.
The MCPF1412 power module is aimed at edge AI applications with a 5.8 mm × 4.9 mm × 1.6 mm Land Grid Array (LDA) package that reduces the required board space by over 40% compared to a discrete design. This comes from the interleaved buck converter design, which minimizes voltage stress on internal power components. This reduces the footprint but allows switching losses similar to those of a conventional interleaved buck converter with the same rating. Additionally, it features an inherent current-sharing mechanism between the two phases.
The power module supports standalone operation without a digital interface, allowing designers to easily configure output voltages using simple resistor divider adjustments and monitor the system via the Power Good output.
Other key features of the MCPF1412 include multiple diagnostic functions such as over-temperature, over-current and over-voltage protection for improved performance and reliability for edge AI servers, processing cards and point of load (PoL) applications. The operating temperature range is TJ −40°C to +125°C. An on-board embedded EEPROM is available for programming the default power-up configuration.
“The MCPF1412 is highly compatible with our FPGAs and PCIe solutions, providing a comprehensive solution for Microchip customers,” said Rudy Jaramillo, vice president of Microchip’s analog power interface division. “This innovative solution minimizes space usage by reducing chip placements when combined with other Microchip devices.”
The MCPF1412 is supported by the EV37R94A Evaluation Board and GUI to help developers evaluate their design and is available for $5.10 each in 10,000-unit quantities.
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