Intel, Qorvo ship chiplet protypes to BAe Systems
Intel and Qorvo have delivered prototypes of its first multi-chip package (MCP) to European defence contractor BAe Systems in the US.
The MCP devices were developed as part of the ‘State-of-the-Art Heterogeneous Integrated Packaging’ (SHIP) programme from the US Department of Defense and cover the Multi-Chip Package (MCP-1) for SHIP Digital from Intel and Qorvo’s Multi-Chip Module (MCM-1) for SHIP Radio Frequency (RF).
Under SHIP Digital, Intel’s MCP-1 is in prototype production and MCP-2 will begin the prototype production process in the near term. Both MCPs contain chiplets with Intel Agilex Field Programmable Gate Array (FPGA) technology. Through Qorvo’s SHIP RF Design Center and Assembly & Test Centre in Richardson, Texas, the MCM-1 will provide form, fit, and function replacement of a legacy chip and wire design, resulting in significant production cost savings, reduced footprint, and improved performance.
Additional prototype devices are in development under the SHIP Program.
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The SHIP program also provides the US government access to Intel’s advanced heterogeneous packaging technologies, including embedded multi-die interconnect bridge (EMIB), 3D Foveros and Co-EMIB. This access enables defence companies to use advanced semiconductor packaging and chiplet libraries, and to quickly specify, prototype, build, test and incorporate advanced devices into field equipment.
This is a key part of Intel’s move to providing a foundry service with advanced process technologies.
“Intel’s first multi-chip package under the SHIP program leverages Intel’s core strength of product and process technology leadership as well as our robust industry partnerships, which are driving the development of new chiplet ecosystems,” said Pat Gelsinger, CEO of Intel.
“Through a close partnership with BAE and the U.S. government, we were able to deliver the prototype six quarters ahead of schedule. Intel is proud to have these critical technology capabilities here in the U.S., which are necessary to quickly develop and build products essential to our defense and national security.”
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