LG signs Blue Cheetah for AI chiplet design
Blue Cheetah Analog Design in the US and LG Electronics are collaborating on a new generation of chiplets.
LG has taped out silicon using the Blue Cheetah chiplet interconnect that could be used for future AI-enabled products. The successful silicon bring-up of a complex System-in-Package (SiP), including chiplets with processors, DDR memory interfaces, AI accelerators, and Blue Cheetah’s die-to-die (D2D) interconnect.
Blue Cheetah provides its customizable physical (PHY) and link layer chiplet interfaces in 16nm, 12nm, 7nm, 6nm, 5nm, 4nm, and below across multiple semiconductor foundries. The IP supports versatile packaging options, including standard and advanced, supporting multiple bump pitches, metal stacks, and orientations. The physical (PHY) IP solutions integrate with on-die buses using the mainstream AMBA CHI, AXI, and ACE standards.
The chiplet IP supports the Universal Chiplet Interconnect Express (UCIe) and Open Compute Project (OCP) Bunch of Wires (BoW) standards.
Tenstorrent signs Blue Cheetah for AI chiplet interconnect
“We chose Blue Cheetah because the company offers the fastest, lowest-risk path to customized chiplet interconnect solutions that we can potentially use across product lines,” said Kim Jin-Gyeong, SVP and Head of SoC R&D Centre of LG. “The company’s BlueLynx die-to-die interconnect IP allows us to combine chiplets in varying process technologies, facilitating more cost-effective scaling and greater IP reuse.”
“We are excited to be working with LG, one of the largest TV manufacturers and a leader in home appliance, air solutions, and home entertainment,” said Elad Alon, CEO at Blue Cheetah. “Successful silicon bring-up of a complex SiP is an essential first step. We look forward to a productive alliance creating innovative chiplet solutions with LG.”
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