Blue Cheetah releases 16Gbps chiplet IP

Blue Cheetah releases 16Gbps chiplet IP

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By Peter Clarke

Blue Cheetah Analog Design Inc. (Sunnyvale, CA) has announced it has made its 2Gbps to 16Gbps BlueLynx die-to-die interconnect IP in a 12nm test chip.

The successful working of the IP has prompted Blue Cheetah to announce the immediate availability of the IP.

Blue Cheetah said it is currently delivering chiplet interconnect IP solutions in 5nm, 7nm, 12nm, and 16nm process technologies, with customers using BlueLynx in data center, networking, and AI applications.

BlueLynx D2D interconnect subsystem IP consists of a PHY and link layer supporting Open Domain-Specific Architecture (ODSA) Bunch of Wires (BoW) and is configurable to support Universal Chiplet Interconnect Express (UCIe).

BlueLynx D2D interconnect features:

  • 5nm, 7nm, 12nm, 16nm process technologies
  • 16Gb/s/wire high bandwidth with support down to 2Gb/s/wire for energy efficiency
  • <2ns end-to-end latency
  • <0.15 mm2 per 16-bit data slice
  • <0.5pJ/bit, <1e-20 error rate
  • 45µm to 130µm bump pitch
  • Up to 25mm trace lengths, compatible with organic substrates or advanced packages
  • Compliant with ODSA Transaction and Link Layer supporting AXI5 Lite (A5L), CHI rev D, virtual wires, and ECC.

“BlueLynx is the industry’s leading standards-based and silicon-proven solution for chiplet die-to-die interconnect IP,” said Elad Alon, CEO at Blue Cheetah, in a statement. “Our test chip and the tape-outs on various process nodes with our customers demonstrate that our customizable, expertly optimized die-to-die interconnect makes chiplets a viable option for any companies pursuing that approach today.”

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