TI’s MagPack offers smaller power module packaging
Texas Instruments has introduced six new power modules designed to improve power density, enhance efficiency and reduce EMI under the name MagPack.
The 6A power modules are suitable for industrial, enterprise and communications applications. They supply a power-density of 1A per square millimeter of footprint area and come in sizes down to 2.3mm by 3.0mm. The name signifies integrated magnetic isolation.
The magnetic packaging technology includes an integrated power inductor with a proprietary material that helps achieve better power density and reduce temperature and radiated emissions.
The parts are cover input voltage ranges from 1.8V to 5.5V through 2.7V to 6V. The device come with a variety of on-chip passive filters, adjustable frequency and synchronization and pulse-frequency and pulse-width modulation control.
Evaluation modules are available at a price of US$49 per item.
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