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Micron breaks ground for Chinese packaging expansion

Micron breaks ground for Chinese packaging expansion

Business news |
By Peter Clarke



Micron has held a ground-breaking ceremony for an additional packaging and testing building at its site in Xian, China, according to Chinese publications.

The plan for the factory and budget of 4.3 billion yuan (about US$600 million) was revealed in June 2023 (see Micron tips China packaging plan as politicians meet). This came shortly after Micron was told that its chips were banned from use in Chinese critical infrastructure (see Micron hit with ban on sales into Chinese ‘critical infrastructure’).

The factory is expected to start production in 2H25 and after completion, will occupy an area of more than 132,000 square meters.

Micron CEO Sanjay Mehrotra, attended the groundbreaking ceremony and said that his company had been investing in China for more than 20 years and has a presence in Beijing, Shanghai, Xi’an and Shenzhen. “Together, we will continue to share the future of the semiconductor industry here in China and across the globe. The best is yet to come,” Mehrotra is quoted saying.

In June 2023 Micron said it planned to acquire equipment from Powercheng Semiconductor (Xi’an) Co. Ltd. (Licheng Xi’an) for a new factory at its Xi’an site. Micron is taking up the employment of all 1,200 employees of Licheng Xi’an as well as creating more than 500 additional jobs. This will bring the total number of Micron employees in China to more than 4,800.

Related links and articles:

www.micron.com

News articles:

Micron tips China packaging plan as politicians meet

Micron hit with ban on sales into Chinese ‘critical infrastructure’

Micron has own take on novel selector-only memory

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