Murata used a combo WiFI6 and Bluetooth 5.3 chipset from NXP Semiconductor for a compact 2 x 2 MIMO module that measures 19.1 mm x 16.5 mm x 2.1 m for embedded designs.
The Type 1XL module uses proprietary packaging and miniaturization technologies around the NXP 88W9098 combo chipset. This supports IEEE 802.11a/b/g/n/ac/ax 2×2 multi-user, multiple-input, multiple-output (MU-MIMO) and Bluetooth 5.3 Low Energy (LE). The WiFi section of the module supports connectivity up to 1.4x faster than conventional Wi-Fi compatible devices, offering data rates of up to 1200 Mbps.
This section also supports the PCIe 3.0 interface with optional support for SDIO 3.0. The Bluetooth 5.3 LE section supports speeds of up to 2 Mbps with a high-speed 4-wire UART interface, optional support for SDIO, and PCM for audio data.
The size enables integration into size- and power-sensitive electronic devices for IoT, smart home, audio/video/voice, smart TV, and gateway applications. It will have a reference antennae design for FCC/IC certifications and CE conducted test to provide a lower development cost and faster time to market.
“The wireless communication bandwidth is tightening within our homes and offices with more streaming content, such as 4K/8K video, and traffic increase by teleworking and remote video conference calls,” said Akira Sasaki, manager of the IoT Module Department at Murata. “The low cost, space-saving Type 1XL module enables high-speed communication, which significantly improves quality.”
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