Next generation ion-driven cooling

Next generation ion-driven cooling

Technology News |
By Nick Flaherty

Ventiva has launched its next-generation thermal management system for cooling electronic equipment.

The Ventiva ICE9 operates through intelligent software-control to manage airflow for a total design power of up to 30 watts.

The compact size ranges between 2mm to 5mm in height and 15mm to 70mm in width, enabling original equipment manufacturers (OEMs) to design space-efficient form factors or easily integrate ICE9 into devices such as laptops, tablets, smartphones, AR/VR headsets, high-definition televisions, wireless charging devices, and gaming electronics.

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The ICE technology moves ionized air molecules within an electric field. The field is created between two small electrodes, a high-voltage wire called the emitter, and a ground electrode, the collector. The electric field generated strips electrons from molecules of nitrogen, oxygen, argon (and other trace elements) in the air, creating ions that are repelled from the positively charged emitter.

A plasma field exists in the gap between the emitter and the collector and consists of the ionization zone and the ion drift zone. The ionization zone is very small, just a few microns in width and is located right next to the emitter.

As positively charged ions move toward the collector, they enter the ion drift zone where they collide with neutral air molecules. These collisions impart momentum to the neutral air molecules, causing them to move toward the collector. The positively charged ions resume their journeys toward the collector and more collisions with other neutral air molecules occur. Soon there is an avalanche of air molecules in motion. The positively charged ions are picked up by the collector and only neutrally charged air molecules exit the ICE apparatus.

This creates airflow under software-control.

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With the increasing reliance on artificial intelligence and high-definition graphics, and the growing use of devices like headset gaming, electronic devices require more processing power which drives the need for improved heat transfer technology to keep devices cool.

“When I talk with executives at OEMs, the number one customer complaint is ‘noisy laptop fans,’” said Carl Schlachte, CEO and Chairman of Ventiva. “ICE9’s revolutionary technology is a silent and vibration-free heat transfer method that elegantly addresses the power demands of integrated circuits and AI-enabled devices to increase performance and user experience. At its highest flow, ICE9 stays quieter than a whisper at less than 15 dBA.”

“ICE9 is a testament that Ventiva is a disruptive force in the electronics industry,” said Schlachte. “OEMs are thrilled to have a cooling solution that removes millimetres off their designs. Engineers welcome the flexibility that our compact cooling technology provides. And, ultimately, ICE9 gives consumers silent, slim, vibration-free devices that can handle their performance needs.”

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