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Design Flow

Design Flow
Cadence, Samsung bring AI to SoC, 3D-IC and chiplet design
Cadence, Samsung bring AI to SoC, 3D-IC and chiplet design
Business news |
Collaboration expanded with a new multi-year IP agreement and joint development of advanced AI-driven flows on the latest SF2P process…
Tenstorrent licenses IP from Baya Systems for AI/RISC-V chiplets
Tenstorrent licenses IP from Baya Systems for AI/RISC-V chiplets
Business news |
Comprehensive fabric tools from Baya Systems will enable Tenstorrent to scale its nest-generation AI and RISC-V chiplet products.
RF design migration flow for the TSMC N6RF+ process node
RF design migration flow for the TSMC N6RF+ process node
Technology News |
Integrated flow accelerates migration of existing N16 process passive RF devices to the advanced N6RF+ technology node for better power,…
Cadence Joules RTL Design Studio delivers breakthrough gains
Cadence Joules RTL Design Studio delivers breakthrough gains
New Products |
Offering accurate insight into physical effects and actionable guidance, the design tool delivers up to 5X faster RTL convergence and…

Cadence design flows and IP for Intel 16 FinFET process
Cadence design flows and IP for Intel 16 FinFET process
Technology News |
Customers can confidently deliver a wide variety of HPC, consumer and USMAG applications based on the Cadence-certified design flows.
Synopsys, Ansys and Keysight offer mmWave design flow for autonomous systems
Synopsys, Ansys and Keysight offer mmWave design flow for autonomous systems
Technology News |
The 79-GHz mmWave RF design flow for TSMC 16FFC accelerates development of RFICs used in autonomous systems.
Digitally wrapped analog IP subsystems enable easy integration
Digitally wrapped analog IP subsystems enable easy integration
New Products |
Digitally wrapped subsystems cut costs and significantly reduce the effort required to integrate multiple analog IP blocks into any ASIC.


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