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PLDs/FPGAs/ASICs Page 34

PLDs/FPGAs/ASICs Page 34
Low-power MEMS mic tolerates overload
Low-power MEMS mic tolerates overload
New Products |
The IM73A135 MEMS microphone from Infineon offers a 73dB signal-to-noise ratio and an acoustic overload point of 135dB sound pressure…
FPGA firm goes public in $2.1bn deal
FPGA firm goes public in $2.1bn deal
Business news |
FPGA designer Achronix Semiconductor is to go public in a $2.1bn reverse merger…
TSMC’s Covid-year revenue boomed 25 percent
TSMC’s Covid-year revenue boomed 25 percent
Business news |
The size of revenue growth enjoyed by Taiwan's leading foundries – TSMC and UMC – has been revealed as the…
FPGA firm Achronix to go public via SPAC
FPGA firm Achronix to go public via SPAC
Business news |
FPGA vendor Achronix Semiconductor Corp. is the latest chip company to go public via a reverse into an acquisition company.

Low-power MEMS microphone tolerates overload
Low-power MEMS microphone tolerates overload
New Products |
The IM73A135 MEMS microphone from Infineon offers a 73dB signal-to-noise ratio and an acoustic overload point of 135dB sound pressure level.
Deep learning processor for always-on audio, sensor apps
Deep learning processor for always-on audio, sensor apps
New Products |
AI semiconductor company Syntiant has announced the availability of its latest generation of special-purpose chips for audio and sensor processing for always-on applications in battery-powered devices, including mobile phones, earbuds,…
WiFi backscatter front-end IP core for 180nm process
WiFi backscatter front-end IP core for 180nm process
New Products |
HaiLa Technologies in Canada has developed a battery-free WiFi backscatter front-end IP core for the 180nm process at GlobalFoundries.
Battery-free WiFi chip IP aims for 180nm process
Battery-free WiFi chip IP aims for 180nm process
New Products |
HaiLa Technologies in Canada has developed a battery-free WiFi backscatter front-end IP core for the 180nm process at GlobalFoundries…
DARPA adds CEVA to its Toolbox
DARPA adds CEVA to its Toolbox
Market news |
CEVA is licensing its digital signal processing IP to the US Defense Advanced Research Projects Agency (DARPA) for research programmes.
CEVA, DARPA partner for technology innovation
CEVA, DARPA partner for technology innovation
Market news |
Signal processing IP provider CEVA has announced an open licensing agreement with the U.S. Defense Advanced Research Projects Agency (DARPA) to accelerate technology innovation for DARPA programs.
Backscatter Wi-Fi transceiver core aims for GloFo 180nm
Backscatter Wi-Fi transceiver core aims for GloFo 180nm
New Products |
Startup HaiLa Technologies Inc. (Montreal, Canada) has revealed some details of its first product, a Wi-Fi backscatter front-end IP core.
Report: TSMC, Japan to share cost of Tokyo chip facility
Report: TSMC, Japan to share cost of Tokyo chip facility
Business news |
Leading foundry TSMC will establish a 50:50 joint venture with Japan's Ministry of Economy, Trade and Industry, to set up an IC packaging and testing facility in Tokyo, according to…
Dialog chooses Germany as EU base
Dialog chooses Germany as EU base
Business news |
Fabless chip vendor Dialog Semiconductor plc has chosen Germany as its new EU home member but will remain headquarters in the UK…
Dialog selects Germany as home EU state post-Brexit
Dialog selects Germany as home EU state post-Brexit
Business news |
Leading mixed-signal, PMIC and RF fabless chip vendor Dialog Semiconductor plc has chosen Germany as its new EU home member.
Fisker has vehicle brain developed by Magna
Fisker has vehicle brain developed by Magna
Business news |
Piece by piece, e-vehicle maker X reveals details of its planned SUV model Ocean: The car’s computer, branded as FI (Fisker Intelligent) Pilot, will be developed on cooperation with automotive…
Europe’s chip market missed out on annual growth in November
Europe’s chip market missed out on annual growth in November
Market news |
Annual growth in the global chip market increased again in November as Europe came close to annual growth and Japan leapt forward, according to numbers gathered by World Semiconductor Trade…
AI-enabled automotive ASIC for driver monitoring systems
AI-enabled automotive ASIC for driver monitoring systems
New Products |
Image sensor manufacturer OmniVision Technologies has announced what it claims is the world’s first dedicated driver monitoring system ASIC with an integrated AI neural processing unit, image signal processor and…
Driver monitor ASIC includes neural processor, DRAM
Driver monitor ASIC includes neural processor, DRAM
New Products |
OmniVision has announced a monitor ASIC with integrated neural processing unit, image signal processor and DDR3 memory included in package.
Analog, MEMS and Sensor startups to follow in 2021
Analog, MEMS and Sensor startups to follow in 2021
Feature articles |
We have renewed our list of analog, MEMS and sensor startups to follow, in the seventh annual iteration of the list. Below are 20 startups to follow in 2021.
Analog articles of 2020
Analog articles of 2020
Feature articles |
Peter Clarke highlights a dozen stories from eenews analog in 2020 that worth a second look.
Boost for foundry market in 2021
Boost for foundry market in 2021
Market news |
The global semiconductor foundry market will rise again in 2021 after a strong 24 percent increase in 2020, according to market analyst TrendForce.
Foundry market jumps 24 percent in 2020
Foundry market jumps 24 percent in 2020
Market news |
The global market for semiconductor foundry services will rise again in 2021 after strong increase in 2020, according to market analyst TrendForce.
Peter’s picks of 2020
Peter’s picks of 2020
Feature articles |
Here are a dozen stories from eenewsnalog in 2020 that we think are worth a second look.
ASIL-D SoC speeds ADAS, automated driving development
ASIL-D SoC speeds ADAS, automated driving development
New Products |
Semiconductor manufacturer Renesas Electronics has unveiled what it claims is a best-in-class ASIL D system on chip (SoC) for advanced driver assistance systems (ADAS) and automated driving (AD) systems.
TSMC hiring for Arizona wafer fab
TSMC hiring for Arizona wafer fab
Business news |
The world's largest foundry, TSMC, is looking for 600 people to work in its 5nm wafer fab, set to be built in Phoenix, Arizona, according to Nikkei Asian Review.
Read the CEO interviews of 2020
Read the CEO interviews of 2020
Interviews |
CEOs from across the industry talked to eeNews Europe about the latest trends in 2020, from design and semiconductors through to manufacturing and distribution.
CEO interviews of 2020
CEO interviews of 2020
Interviews |
We conducted seven CEO interviews in 2020. They ranged in scope from IP through fully homomorphic encryption to RFSOI, graphene, ferroelectric memories and radical RISC-V implementation.
Report: Europe claims US using Chinese sanctions unfairly
Report: Europe claims US using Chinese sanctions unfairly
Business news |
European leaders have accused the US government of using its Chinese sanctions regime to deny European firms access the Chinese market while giving exceptions to US firms, writes the FT.


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