Winbond teams for low power HyperRAM designs
Winbond Electronics has teamed up with Mobiveil on an IP controller for low power HyperRAM memory applications such as wearables, TWS, Wireless Headsets and smart speakers, and Connectivity.
Mobiveil has adapted its HyperRAM controller to make use of the characteristics of Winbond’s 250MHz devices with densities from 32Mb to 512Mb in x8/x16 modes. Integrating Mobiveil’s 250MHz controller into a system on chip design provides high performance at very low power for battery-operated applications. The low pin count of the design saves space.
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“The HyperRAM supports HyperBUS Interface, enabling speeds of up to 500Mbps (x8 I/O) with just 13 signal pins,” said Mobiveil CEO Ravi Thummarukudy.
The controller provides support for AXI Memory-Mapped system interfaces, Linear/Hybrid/Wrap burst support, low power features like deep power-down and hybrid sleep mode. It also supports AMBA AHB-Lite system interfaces.
“HyperRAM is designed to enhance the IoT experience for end-users and provide a cost-effective, ultra-low power memory solution to system designers. Winbond’ss HyperRAM 3.0, with a 22-pin count and an increased data transfer rate of 1000Mbps (x16 I/O), has won the 7th China IoT Innovation Awards, 2022,” said Hsiang-Yun Fan, DRAM Vice President of Winbond, which has shipped over 400 million devices since its inception.
Mobiveil is headquartered in Silicon Valley with engineering development centresin Milpitas, CA, Chennai, Bangalore, Hyderabad, Rajkot, India.
https://mobiveil.com; www.winbond.com
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