MicroSys, Hailo team for embedded AI platform

September 30, 2021 // By Nick Flaherty
MicroSys, Hailo team for embedded AI platform
The MicroSys miriac embedded modules and platforms use up to eight the Hailo-8 AI acceleration modules for a scalable embedded AI platform with up to 130TOPS

MicroSys Electronics in Germany has teamed with AI chip make Hailo on an embedded AI platform for Industry 4.0 applications such as predictive maintenance analytics.

The miriac AIP-LX2160A embedded platform can host up to 5 integrated Hailo-8 AI accelerator modules. The platform is powered by the NXP QorIQ Layerscape LX2160A high-throughput processor for up to 130 TOPS for deep learning. This provides AI computing performance across multiple standard NN benchmarks, including over 6000 Frames Per Second (FPS) on Resnet-50, over 5000 FPS on Mobilenet-V1 SSD and close to 1000 FPS on YOLOv5m.

Each module provides up to 26 TOPS at a typical power consumption of 2.5 W.

“Our strategic partnership with Hailo is an important milestone, helping our customers reap the enormous benefits of AI and neural networks,” said Ina Sophia Schindler, Managing Director at MicroSys Electronics. “Hailo’s AI processor allows edge devices to run full-scale deep learning applications more efficiently, effectively, and sustainably while significantly lowering costs. In combination with our NXP processor-based platforms, our customers get one of the most powerful AI solutions that can be developed for edge applications.”

Typical markets for the platform include low-power IIoT and Industry 4.0 edge servers for predictive maintenance, collaborative robotics, video surveillance servers in infrastructures with distributed cameras, communication servers for autonomous vehicles in logistics and agriculture, and heavy equipment for construction, as well as edge servers in trains where multiple GigE Vision camera streams are analyzed with AI for increased safety and security.

“We are excited to partner with MicroSys, a world-leader in embedded systems,” said Orr Danon, CEO and Co-Founder of Hailo. “This collaboration strengthens our position in the edge computing sector, enabling us to further address the rapidly growing market seeking embedded edge platforms with robust AI capabilities. We look forward to continuing to work with MicroSys to bring unmatched edge processing solutions to a broad range of automotive and industrial automation applications.”

The AI platform includes a carrier board, cable set and cooling solution. Developers will also have access to MicroSys’s comprehensive AI toolchain and developer tools offered in Hailo’s developer zone.

hailo.ai; microsys.de

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