SLAM SDK targets mobile, AR/VR and autonomous mobility

May 20, 2019 // By Julien Happich
DSP IP licensor CEVA has announced a software development kit, CEVA-SLAM, aimed at streamlining the development of Simultaneous Localization and Mapping (SLAM) enabled products.

Those include mobile devices, AR/VR headsets, robots, autonomous vehicles and other camera-based devices. Developed for the CEVA-XM family of intelligent vision DSPs and the NeuPro family of AI processors, CEVA-SLAM incorporates the hardware, software and interfaces required to significantly lower the entry barrier for companies looking to integrate efficient SLAM implementations into low-power embedded systems.

The SDK includes a detailed interface from a CPU to offload the heavy lifting SLAM blocks to the CEVA-XM DSP. These building blocks use the DSP efficiency to support both fixed point and floating point math and extend the device’s battery life.

The SDK building blocks include capabilities for image processing, linear algebra, fast sparse equation solving for bundle adjustment and more. Running a full SLAM tracking module on the CEVA-XM6 DSP at 60 frames per second consumes only 86mW. When deployed with a CEVA-XM DSPs or a NeuPro AI processor, customers can address a broad range of use cases and applications requiring SLAM, such as visual positioning, along with classical and Neural Network workloads for imaging and vision, all in a unified hardware platform that is easy to program. The CEVA-SLAM SDK is available for licensing today, exclusively in conjunction with the CEVA-XM intelligent vision DSPs and NeuPro AI processors.


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