Cadence develops AI thermal design and analysis platform
Cadence Design Systems is offering early access to a new tool that uses machine learning for thermal analysis of system designs including chiplet packages.
Cadence says Celsius Studio is the industry’s first complete AI thermal design and analysis solution for electronic systems. Celsius Studio addresses thermal analysis and thermal stress for 2.5D and 3D-ICs and IC packaging, in addition to electronics cooling for PCBs and complete electronic assemblies.
While design flows need disparate point tools, Celsius Studio introduces an entirely new approach with a unified platform that lets electrical and mechanical/thermal engineers concurrently design, analyze and optimize product performance without the need for geometry simplification, manipulation and/or translation.
The AI-enabled thermal, stress and electronics cooling in-design analysis helps designers use ECAD and MCAD tools seamlessly for multiphysics simulation of electro-mechanical systems. The convergence of FEM and CFD engines addresses thermal integrity challenges from the chip to the packaging, to the board and out through the complete electronic system.
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The Celsius Studio is designed for massively parallel execution and Cadence says this achieves up to 10X faster performance than previous tools. It is integrated within Cadence IC, packaging, PCB and microwave design platforms for in-design thermal analyses as well as final signoff.
This comes from the Cadence acquisition of Future Facilities in 2022, adding generative AI optimization and novel modeling algorithms for thermal analysis technology to electrical and mechanical engineers alongside multiphysics analysis early in the design proces.
- Future Facilities deal adds digital twins expertise
- AI automates move to 3nm and 2nm
- UMC’s chiplet reference flow
The result is a streamlined workflow that improves collaboration, reduces design iterations and allows predictable design schedules, which in turn reduces turnaround and development times.
The Optimality Intelligent System Explorer AI technology within Celsius Studio enables fast and efficient exploration of the full design space to converge on the optimal design, while the in-design analysis supports any 2.5D and 3D-IC packages without any simplification or accuracy loss
The Celsius Studio is also the first tool capable of modeling structures as small as the IC and its power distribution and as large as the chassis where the PCB(s) are placed, and can also accurately simulate large systems with detailed granularity for any object of interest including, chip, package, PCB, fan or enclosure.
The true system-level thermal analyses combine finite element method (FEM) with computational fluid dynamics (CFD) from chip to package to board and end-system and the tool is integrated with Virtuoso Layout Suite, Allegro X Design Platform, Innovus Implementation System, Optimality Intelligent System Explorer and AWR Design Environment.
“Celsius Studio marks a milestone in Cadence’s expanding presence in the system analysis market by offering the first AI platform for not only chip, package and PCB thermal analysis, but also electronics cooling and thermal stress that are critical for today’s advanced packaging designs, inclusive of chiplets and 3D-ICs,” said Ben Gu, corporate vice president of R&D for multiphysics system analysis at Cadence. “Seamless integration with Cadence’s powerful implementation platforms empowers our customers to perform multiphysics in-design analysis for chips, packages and boards all the way through to complete systems.”
“Celsius Studio enables Samsung Semiconductor engineers the ability to gain access to analysis and design insights during the early stages of the design cycle, simplifying the generation of precise and rapid thermal simulations for 3D-IC and 2.5D packages. Our collaboration with Cadence has significantly increased our product development by 30%, optimizing the package design process and reducing turnaround time,” said WooPoung Kim, Head of Advanced Packaging, Samsung Device Solutions Research America
“Celsius Studio’s seamless integration with Cadence’s AWR Microwave Office IC design platform through BAE Systems’ custom GaN PDK is enabling fast and accurate thermal analysis throughout the MMIC design cycle, leading to increased first-pass design success and significantly improved RF and thermal power amplifier performance,” said Michael Litchfield, Technical Director, MMIC Design at BAE Systems.
“Celsius Studio enables our design team to work with detailed information early in our design cycle so that we can target and resolve thermal problems before the design is fully committed. With the reduced turnaround time, the Chipletz engineering team has been empowered to efficiently run detailed thermal simulations for 3D-IC and 2.5D packages early and often as we develop these complex designs,” said Jeff Cain, VP of Engineering at Chipletz
Customers interested in gaining early access to Celsius Studio should contact their Cadence account representative.
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