imec, ASML team for pilot line for sub-1nm development
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Belgian research lab imec has signed a key deal with ASML for the latest lithography equipment for a sub-1nm pilot line.
A Memorandum of Understanding signed today includes the installation and servicing of ASML’s full suite of advanced lithography and metrology equipment in the imec pilot line in Leuven, Belgium.
This includes tens of millions of euros of equipment with the latest model 0.55 NA EUV, the TWINSCAN EXE:5200 which is key for 2nm and 1nm process development, as well as the latest models 0.33 NA EUV TWINSCAN NXE:3800. The deal also includes DUV immersion with the TWINSCAN NXT:2100i, Yieldstar optical metrology and HMI multi-beam.
“This commitment from ASML, which builds on over 30 years of successful collaboration, sends a powerful signal of our unwavering dedication to drive the advancement of sub-nanometer chip technology,” said Luc Van den hove, President and Chief Executive Officer of imec.
Significant investments are needed to secure industry-broad access to High-NA EUV lithography beyond 2025 when 2nm process technology becomes commercial and to retain the related advanced node process R&D capabilities in Europe.
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The Memorandum of Understanding kickstarts the next phase of intensive collaboration between ASML and imec on High-NA EUV. The first phase of process research is being executed in the joint imec-ASML High-NA lab using the first High-NA EUV scanner, the TWINSCAN EXE:5000.
imec and ASML work with all the leading-edge chipmakers and materials and equipment ecosystem partners, with the goal to prepare the technology for the fastest possible adoption in mass manufacturing.
The state-of-the-art high-numerical aperture (High-NA) extreme ultraviolet (EUV) lithography pilot line at imec is intended to help the industries using semiconductor technologies to understand the opportunities that advanced semiconductor technology can bring and have access to a prototyping platform that will support their innovations.
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The collaboration between imec, ASML and other partners will enable the exploration of novel semiconductor applications, the potential development of sustainable, leading-edge manufacturing solutions for chip makers and end users, as well as the development of advanced holistic patterning flows in collaboration with the equipment and material ecosystem.
This groundbreaking new High-NA technology is crucial for developing high-performance energy-efficient chips, such as next-generation AI systems.
Part of the collaboration between imec and ASML is therefore captured in an IPCEI proposal which is currently in review by the Dutch government.
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“ASML is making a substantial commitment in imec’s state-of-the-art pilot fab to support semiconductor research and sustainable innovation in Europe. As artificial intelligence (AI) rapidly expands into domains such as natural language processing, computer vision and autonomous systems, the complexity of tasks escalates. Therefore, it is crucial to develop chip technology that can meet these computational demands without depleting the planet’s precious resources,” said Peter Wennink, President and Chief Executive Officer of ASML.
www.imec-int.com; www.asml.com
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