Spansion and SK Hynix announce NAND partnership

Spansion and SK Hynix announce NAND partnership

Business news |
By eeNews Europe

The alliance, which will make its first Spansion SLC NAND products available from the second quarter of 2012, will see the companies enter into a patent cross-licensing agreement in order to facilitate commercial manufacture. Spansion’s NAND products supplement the alliance’s NOR flash memory range, aimed at serving embedded applications such as automotive, industrial and telecommunications industries. The existing range of products will be consolidated with a family of new NAND products over the coming months. Spansion will also continue the development of its charge-trapping NAND technology.

John Kispert, president and CEO of Spansion, commented, “As demand for NAND memory grows in embedded segments, we are well positioned as we continue to broaden our portfolio of Flash memory products to meet the stringent requirements of the embedded industry. Our cooperation with SK Hynix will enable us to expand our leadership in the embedded market with serial NOR, parallel NOR and now SLC NAND products.”


Related news:

Spansion aims to replace DRAMs in datacenters

Will Spansion succeed or fail again?

IEDM: Hynix takes NAND to 15-nm

SanDisk, Hynix plan NAND joint venture

Hynix and Toshiba sign joint development for MRAM


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