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Computer memory with a spin
Computer memory with a spin
News |
Iron-rich hematite has magnetic properties that allows charge-free magnetic waves to send and store data For now computer memories rely…
ZeroPoint compression increases AI memory by 50 percent
ZeroPoint compression increases AI memory by 50 percent
New Products |
ZeroPoint Technologies AB (Gothenburg, Sweden) has announced a hardware-assisted compression technology that it claims can be used to increase the…
Computer memory with a ‘bucket’ list
Computer memory with a ‘bucket’ list
News |
How 3D charge-coupled devices can promise an alternative to DRAM architectures – Imec research update The traditional memory access in…
Micron breaks ground on US$7 billion Singapore HBM packaging facility
Micron breaks ground on US$7 billion Singapore HBM packaging facility
Business news |
Micron Technology Inc. (Boise, Idaho) has broken ground on a high-bandwidth memory (HBM) packaging facility in Singapore adjacent to the…

SK Hynix is making a 321-layer NAND flash memory
SK Hynix is making a 321-layer NAND flash memory
New Products |
Memory chip maker SK Hynix has said its 321-layer NAND flash chip has a memory capacity of 1Tbit and will be available in 1H25. The chip makes use of triple-level…
VyperCore accelerator chip adopts Solid Sands for C/C++ compliance
VyperCore accelerator chip adopts Solid Sands for C/C++ compliance
Business news |
The collaboration will ensure compliance to the highest quality levels with C and C++ language standards for the new accelerator chip.
First complete memory interface for next generation DDR5 server MRDIMMs
First complete memory interface for next generation DDR5 server MRDIMMs
New Products |
Multiplexed registered clock driver, multiplexed data buffer and PMIC enables up to 12,800 MT/s for DDR5 AI and HPC applications.
SK Hynix prepares 16-layer HBM3e DRAM for 2025
SK Hynix prepares 16-layer HBM3e DRAM for 2025
New Products |
SK Hynix has announced that its 16-layer HBM3e DRAM will be available in 2025. The device is expected to sample in 1H25. The company’s CEO, Kwak Noh-Jung, announced the development…
Magnetic octupoles overcome problems with antiferromagnets
Magnetic octupoles overcome problems with antiferromagnets
News |
Physicists at RIKEN have demonstrated how ultrafast, low-power-consumption memory devices could be realized by replacing conventional magnetic materials with novel ones In conventional hard disk drives, the magnetic disk has…
SK Hynix scores record profits, doubles sales on AI demand
SK Hynix scores record profits, doubles sales on AI demand
Business news |
The leading position of SK Hynix Inc. (Seoul, South Korea) in high bandwidth memory (HBM) DRAM enabled the company to make a record net profit of about US$4.14 billion in…
Kioxia to detail emerging memory advances at IEDM 2024
Kioxia to detail emerging memory advances at IEDM 2024
Technology News |
Innovative DRAM, MRAM and 3D flash emerging memory technologies address future AI, computing and storage systems applications.
IEDM: Samsung speeds selection of selector-only memory materials
IEDM: Samsung speeds selection of selector-only memory materials
Technology News |
Samsung has used computer modelling to accelerate the selection of a material system for selector-only-memory (SOM). Researchers are due to present a paper on the work at this year’s International…
NXP partners with Raaam for SRAM replacement
NXP partners with Raaam for SRAM replacement
Business news |
IP licensing startup Raaam Memory Technologies Ltd. (Petah Tikva, Israel) has announced it is in a collaboration with NXP Semiconductors concerning its CMOS-compatible embedded DRAM. Raaam calls the technology Gain-Cell…
Samsung, TSMC team up on HBM4 DRAM
Samsung, TSMC team up on HBM4 DRAM
Business news |
Samsung and TSMC are teaming up to produce a bufferless high bandwidth memory (HBM) DRAM, according to The Korea Economic Daily, quoting Dan Kochpatcharin, head of ecosystem and alliance management…
DDR5 client clock driver for high performance PCs
DDR5 client clock driver for high performance PCs
New Products |
DDR5 clock driver leverages broad server memory expertise to enable state-of-the-art DDR5 client DIMMs with operation up to 7200 MT/s.
SK Hynix plans 30x improvement on HBM with custom variants
SK Hynix plans 30x improvement on HBM with custom variants
Technology News |
Ryu Seong-su, vice president of SK Hynix, has announced plans for his company to develop products with 30x the performance of high-bandwidth memory (HBM) DRAM, and offer customer-specific products, according…
Kioxia files for Tokyo IPO in October
Kioxia files for Tokyo IPO in October
News |
Japanese memory chip maker Kioxia has filed to list on the Tokyo Stock Exchange. The IPO could take place as soon as October, according to reports. Kioxia, previously Toshiba Memory,…
Paving the way to extremely fast, compact computer memory
Paving the way to extremely fast, compact computer memory
Technology News |
For decades, scientists have been studying a group of unusual materials called multiferroics that could be useful for a range of applications including computer memory, chemical sensors and quantum computers…
DRAM revenues surged in 2Q24
DRAM revenues surged in 2Q24
Market news |
DRAM sector revenues increased to US$22.9 billion in 2Q24, a 24.8 percent sequential rise, according to market analyst TrendForce. This surge was driven by expanded shipments of mainstream products that…
Your kitchen sponge as a memory device
Your kitchen sponge as a memory device
Technology News |
Kitchen sponges — a network of soft polymeric rods — can act as memory devices, an experiment has shown – source: Nature When Harsh Jain, at the National Centre…
Researchers find new material for optical memory
Researchers find new material for optical memory
Technology News |
Optical memory using MnBi2Te4 could be orders of magnitude more efficient than current electronic memory devices.
LPDDR5X DRAM packages for on-device AI in mass production
LPDDR5X DRAM packages for on-device AI in mass production
Business news |
Compact LPDDR5X DRAM packages measure 0.65 mm high, allowing enhanced thermal control suitable for on-device AI mobile applications.
JEDEC unveils new memory standards to drive HPC and AI
JEDEC unveils new memory standards to drive HPC and AI
Technology News |
Upcoming DDR5 MRDIMM and LPDDR6 CAMM memory standards set to deliver unparalleled bandwidth and memory capacity.
Raaam signs lead licensee for SRAM replacement technology
Raaam signs lead licensee for SRAM replacement technology
Interviews |
Memory IP licensing startup Raaam Memory Technologies Ltd. (Petah Tikva, Israel) has signed a major fabless chip company as its lead partner to help it develop an alternative to static…
JEDEC preps finalization of HBM4 standard
JEDEC preps finalization of HBM4 standard
Technology News |
The JEDEC Solid State Technology Association has announced it is nearing completion of the next version of its High Bandwidth Memory (HBM) DRAM standard: HBM4. The HBM4 standard has been…
Memory chip prices set to rise ‘just’ 10% in Q3
Memory chip prices set to rise ‘just’ 10% in Q3
Market news |
Contract prices for memory chips are expected to continue to show increases in Q3 but less than those experienced in Q2 as supply and demand come closer to being in…
CXMT to invest US$2.35 billion in AI memory packaging fab
CXMT to invest US$2.35 billion in AI memory packaging fab
Business news |
Chinese DRAM maker ChangXin Memory Technologies Inc. (CXMT) is set to spend 17.1 billion yuan (about US$2.35 billion) to build an advanced packaging plant in Shanghai, according to Bloomberg. The…
Rambus offers DDR5 server PMICs to address AI workloads
Rambus offers DDR5 server PMICs to address AI workloads
New Products |
Industry-leading DDR5 server PMICs for the highest performance and capacity memory modules required by AI and other advanced workloads.


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