Top ten articles on eeNews in September
September saw a wide range of popular articles, from the latest electronic materials to the challenges at Intel.
Lumotive launched an open development kit for its automotive metasurface material, while Greenerwave in France opened up its reconfigurable intelligent surface, or RIS, another type of metasurface, for next generation 6G networks.
NXP saw a key deal with Raam for a replacement for SRAM memory while the Glass Substrate Alliance was launched to provide a lower cost platform for chiplet designs.
Maritime Robotics raised $12m for its autonomous ship technology, while ST launched its fourth generation of 750V and 1200V silicon carbide (SiC) power devices for electric vehicle designs. AMD shrunk its packaging for automotive FPGAs, while the risks facing Europe from the coming semiconductor downturn as highlighted by Malcolm Penn at Future Horizons were of key concern.
But it is the challenges faced by Intel that dominated the month. A team of Intel CPU architects left to set up a startup working on RISC-V chip designs, and Intel pausing its manufacturing plans in Germany were of most interest in September.
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