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Page 3250
IAR launches development kit for Freescale Kinetis K60 and modular Tower System
IAR launches development kit for Freescale Kinetis K60 and modular Tower System
New Products |
IAR Systems today announced availability of a new IAR KickStart Kit for Freescale Semiconductor's ARM Cortex-M4 based Kinetis family of …
Samsung rebrands its application processors
Samsung rebrands its application processors
Market news |
As the power of branding takes hold at every level in the electronics industry, illustrated most convincingly perhaps by Apple,…
Digi-Key and Interlink Electronics sign global distribution agreement
Digi-Key and Interlink Electronics sign global distribution agreement
Business news |
Distributor Digi-Key and Interlink Electronics have entered into an agreement, making Interlink Electronics’ products available for purchase on Digi-Key's global…
Synopsys, Varian to develop TCAD models for logic, memory devices
Synopsys, Varian to develop TCAD models for logic, memory devices
Business news |
Synopsys and Varian Semiconductor Equipment Associates have joined forces to develop Technology CAD (TCAD) models that address cryogenic ion implantation…

Power management solution reduces charging time by 50 percent in mobile devices
Power management solution reduces charging time by 50 percent in mobile devices
New Products |
ST-Ericsson is launching a power management solution that significantly reduces the charging time for mobile devices from a wall socket. This innovation is part of ST-Ericsson's latest PowerHUB™ family of…
MIPS Technologies and 4M Wireless demonstrate 3G/4G multimode protocol stacks on MIPS® architecture
MIPS Technologies and 4M Wireless demonstrate 3G/4G multimode protocol stacks on MIPS® architecture
Technology News |
MIPS Technologies has announced that 4M Wireless will demonstrate 3G/4G multimode user equipment (UE) operation on the MIPS® architecture during the 2011 Mobile World Congress.
STMicroelectronics partners bTendo to develop the world’s smallest pico projector for smart phones
STMicroelectronics partners bTendo to develop the world’s smallest pico projector for smart phones
Business news |
STMicroelectronics and bTendo Ltd. have signed a development and license agreement to jointly develop the world’s smallest Pico Projector for smart phones and other portable consumer-electronics devices. The solution is…
10 Gb/s multipoint microwave backhaul platform
10 Gb/s multipoint microwave backhaul platform
New Products |
Cambridge Broadband Networks Limited has launched its 10 Gb/s multipoint microwave backhaul platform. VectaStar Radio Controller (RC), the latest development of the company's VectaStar microwave backhaul and access solution, is…
MediaTek licenses Swedish DSP architecture
MediaTek licenses Swedish DSP architecture
Business news |
Coresonic AB, a licensor of DSP technology for baseband applications founded in 2004, has announced that it has licensed its SIMT DSP architecture to MediaTek Inc. Neither the terms of…
SOI group moves on mobile front
SOI group moves on mobile front
Business news |
Jockeying for position in the next-generation transistor race, the SOI Industry Consortium claims to have made more progress in bringing fully-depleted silicon-on-insulator (FD-SOI) technology for next-generation mobile products.
Startup introduces RF power management IC
Startup introduces RF power management IC
New Products |
Quantance has developed the Q1005 IC that combines power conversion with closed-loop feedback and is intended to boost the efficiency of power amplifiers in wireless devices.
Win one of two radio energy harvesting kits on offer
Win one of two radio energy harvesting kits on offer
Feature articles |
This month, Powercast is giving away two of it radio energy harvesting kits, one worth €964 geared towards powering wireless sensors (P2110-EVAL-01) and the other worth €694 (P2110-EVAL-02) more specifically…
Single-SoC platform for concurrent 3G and 4G service operation
Single-SoC platform for concurrent 3G and 4G service operation
New Products |
DesignArt Networks has recently unveiled its ground-breaking 40-nm 4G SoC family with the launch of five distinct SoC chips. Today the company released its second open SoC platform – the…
Silver conductive epoxy with low outgassing
Silver conductive epoxy with low outgassing
New Products |
Master Bond EP21TDCS-LO is an electrically conductive silver-filled epoxy that passes ASTM 595 for NASA low outgassing specifications. The adhesive cures at room temperature in 24-48 hours and in just…
Waterproof RF connectors for marine and harsh environments
Waterproof RF connectors for marine and harsh environments
New Products |
Intelliconnect launched a wide range of IP67 and IP68 interconnect solutions for harsh environments. Qualified to withstand immersion at a minimum of 20m for four hours in their unmated condition,…
Valve controllers for dispensing fluids with accuracy
Valve controllers for dispensing fluids with accuracy
New Products |
Nordson EFD has introduced two new valve controllers, particularly designed to increase output and profitability for manufacturers in the product assembly market. The ValveMate 7100 and ValveMate 7140 dispense valve…
Freescale expands Tower System with new, feature-rich modules
Freescale expands Tower System with new, feature-rich modules
New Products |
Eleven additions to modular tool line-up aim to help embedded developers accelerate prototyping and time to market for medical and industrial applications. New controller modules feature the ARM Cortex-M4 based…
Aerco stocks high-reliability connectors with 360° electrical screening
Aerco stocks high-reliability connectors with 360° electrical screening
New Products |
Harwin Datamate S-Tek 2mm, high-reliability connectors, now stocked by Aerco, are designed for applications that require high levels of EMC such as military, aerospace, industrial and control equipment. Based on…
C2X communications scheme takes shape
C2X communications scheme takes shape
Technology News |
Car-to-car and car-to-infrastructure communications, summarily called C2X, is one of the big technology projects currently under development in the automotive and IT industries. The Fraunhofer Institute for communication technology systems…


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