SMT press-fit card-edge connector system
The surface mount device solder interface uses pin in paste through-hole technology as well as recessed channels for improved solder distribution which allows for high mechanical strength at the point of connection. The SMT card edge contact system is designed for standard 1.6 mm thick printed circuit boards but is compatible with additional PCB thicknesses. The center minimum PCB spacing is 3.2 mm. The product features Interplex’s proven and tested 0.64 mm press-fit technology. It is packaged in a 16x4mm pitch EIA tape on a 13” diameter plastic reel for compatibility to standard high-speed surface mount pick-and-place equipment. It is suitable for high-conductivity material, able to carry up to 15 amps per contact.
Visit Interplex Industries at www.interplex.com
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