Cambridge GaN Devices adds 2D bar codes for power die tracking
Cambridge GaN devices (CGD) is adding 2D barcodes to its integrated power die that can be read by a commercial code reader.
This not only enables CGD to scan packaged GaN power devices and identify the circuit and the batch but also to learn exactly whereabouts on the wafer each individual die was made. This can provide key data for process ruggedness and reliability and supply chain verification.
The 2D barcode is added to the planar ICeGaN devices with integrated control and sensing and was developed with the packaging team to give visibility for a barcode reader.
“We engineered the incorporation of individual 2D barcodes with our packaging team to give us complete ownership of the process and the ability to resolve any reliability issues. We know, for example, that yields are lowest at the wafer edge – now we can see how the position on the wafer might affect device performance. This information can be fed back to the foundry to enable continuous manufacturing process improvements,” said Zahid Ansari, vice president of operations at CGD.
The ability to use a cheap, commercial barcode reader also has huge implications for speeding up anti-counterfeiting measures, which will be of great interest to companies operating in hi-reliability fields.
“Although we have a great deal of data to prove the ruggedness and reliability of our ICeGaN HEMTs, GaN is still a relatively new technology, certainly when compared to traditional silicon for power electronics applications. By incorporating 2D barcodes we are able to provide extremely fast feedback to our manufacturing supply chain, which helps cement our relationships and scale-up for high volume manufacture,” said Giorgia Longobardi, CEO.
CGD has so far successfully secured four projects funded by Innovate UK, BEIS and EU (Penta).
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