Japan budgets $2.4 billion for chip R&D hub with US, Europe
The Japan government has set aside a budget of 350 billion yen (about US$2.4 billion) to create a joint R&D hub with US and European participants, according to Nikkei.
The joint research hub is due to be established by the end of the fiscal year with the goal of putting in place the ability to make 2nm chips in the second half of the decade.
The University of Tokyo, the National Institute of Advanced Industrial Science and Technology and science institute Riken will participate as will companies and research institutions from the US and Europe, Nikkei said.
The names of participating companies will be announced later this month. IBM, which has developed its own 2nm nanosheet manufacturing process, is among the candidates for participation (see IBM announces 2nm chip, and manufacturing process). A research institute such as IMEC and lithography equipment maker could be candidates from Europe.
The funding support for R&D is part of moves by a number of regions to increase domestic semiconductor resilience as well as a reaction to an escalating US-China trade war. Both the US and European Union have both passed their own “Chip Act” to encourage investment in close to leading-edge domestic chip manufacturing.
The Japanese government’s supplementary budget for the fiscal year also includes 450 billion yen (about US$3.0 billion) for supporting the building of wafer fabs in Japan and 370 billion yen (about US$2.5 billion) for securing sources of materials for manufacturing.
The government has already approved subsidies for TSMC, Kioxia, and Micron Technology to build plants in Japan.
Related links and articles:
Nikkei Asia article
News articles:
IBM announces 2nm chip, and manufacturing process
Sony to invest $500 million in TSMC wafer fab deal
Japan will provide Micron with $320 million subsidy
Kioxia, Western Digital to get $690 million subsidy for wafer fab
If you enjoyed this article, you will like the following ones: don't miss them by subscribing to :
