Rapidus taps Fraunhofer for 2nm packaging tech

Rapidus taps Fraunhofer for 2nm packaging tech

Technology News |
By Nick Flaherty

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Rapidus is working with Fraunhofer IZM in Germany on packaging technology to mount its 2nm gate all around (GAA) chips.

Packaging is a key part of the plan for the Rapidus plant being built in Hokkaido, Japan, using 2nm semiconductor expertise from IBM and expertise form Fraunhofer IZM.

“A high end chip is the baseline, then customers are facing more challenges with the backend than the front end,” Henri Richard, general manager of Rapidus Design Solutions and responsible for business development manager at Rapidus told eeNews Europe. “Here are variety of technologies not only for power but to manage the complexity.”

“We intend to have the back end in Hokkaido as a differentiator and will be able to build the first fully integrated front and back end fab in the industry,” he said. ”We have a clean sheet of paper and part of the secret source is some very interesting ideas on integrating the chips.”

“There will be more details later this year and early next year as it’s an important competitive advantage at these geometries and for the cycle time,” he said. “The notion that we will reinvent the way that front and back end chip design work together to accelerate cycle time, and we think we can be 50% faster.”

Japan’s METI government agency highlighted some of the work that Fraunhofer is doing with Rapidus. This will use 2µm line interconnect with a 2µm separation and a 3um ball pitch on the 2nm chips to mount them on a substrate. This substrate can be be size of the reticle at 6640mm2.  

“In March, we had a very inspiring meeting with Rapidus‘ president, Dr. Atsuyoshi Koike, in which he clearly emphasized the importance, not only to develop the most advanced node chip technology but also a highly advanced packaging technology to enable overall best-in-class performance. I‘m really looking forward to a fruitful cooperation with full commitment by everyone involved,” said Dr. Michael Schiffer, project leader at Fraunhofer IZM.

The 2nm cooperation also includes packaging company A star in Singapore.


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