Report: Samsung plans third Texas wafer fab at US$24 billion cost
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South Korea’s Samsung is planning to construct its third fab in the US in Taylor, Texas, at a cost of about US$24 billion, according to The Wall Street Journal.
This is set to break down as about US$20 billion for a chip manufacturing facility and US$4 billion for an advanced packaging and R&D facility, the report said.
No timetable for construction and first chip production has yet been given. Nor has an indication of the manufacturing node Samsung will introduce there although it is likely to be close to the current leading-edge.
Other sources said Samsung will receive about US$6.6 billion in support from the US government under the CHIPS and Science Act to double its investment in Taylor, Texas. The move shows similarities to those of TSMC which announced its plan to increase its US manufacturing footprint by the end of the decade (see TSMC agrees to build third Arizona fab, make 2nm chips in US).
Samsung’s largest fab in the US is in Austin, Texas. It has been operational since 1996 and provides manufacturing of 65nm to 14nm processes.
Samsung announced a plan to spend US$17 billion to build its first Taylor fab in November 2021 although that budget is thought to have drifted up to about US$20 billion in the interim. That fab is due to begin production in 2024.
Samsung will now reportedly hold an event in Taylor next Monday, April 15, to provide an update and announce its third fab.
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