MENU

DRAM

DRAM
3D DRAM breakthrough promises major AI inference performance gains
3D DRAM breakthrough promises major AI inference performance gains
New Products |
d-Matrix and Alchip have announced a joint effort to develop what they call the world’s first 3D…
JEDEC releases LPDDR6 targeting mobile and AI
JEDEC releases LPDDR6 targeting mobile and AI
Technology News |
JESD209-6 LPDDR6 standard significantly advances memory technology for enhanced performance, power efficiency, and security.
First LPDDR6/5X 14.4-Gbps memory IP targets AI infrastructure
First LPDDR6/5X 14.4-Gbps memory IP targets AI infrastructure
New Products |
Comprising an advanced PHY architecture and a high-performance controller, the integrated memory IP subsystem is optimised for customer applications, including…
KIOXIA open source software advances AI RAG
KIOXIA open source software advances AI RAG
Technology News |
Open-source AI RAG software enables flexible balancing of capacity and performance based on user needs and environment.

Primemas samples first chiplet-based CXL 3.0 SoCs
Primemas samples first chiplet-based CXL 3.0 SoCs
New Products |
Primemas is collaborating with the Micron CXL AVL programme to speed up the commercialisation of next-generation memory for data centres and AI infrastructure.
DRAM memory without the capacitor shows promise
DRAM memory without the capacitor shows promise
News |
A new DRAM bit cell without a capacitor and with two thin-film transistors shows promises for continuing the DRAM technology roadmap An imec report: The bit cell of…
SK Hynix grabs DRAM market share on AI-inspired growth
SK Hynix grabs DRAM market share on AI-inspired growth
Market news |
The AI boom via server and HBM components drove the DRAM sector’s growth up 9.9 percent sequentially in the 4Q24, according to TrendForce. The growth driven by rising contract prices…
Micron breaks ground on US$7 billion Singapore HBM packaging facility
Micron breaks ground on US$7 billion Singapore HBM packaging facility
Business news |
Micron Technology Inc. (Boise, Idaho) has broken ground on a high-bandwidth memory (HBM) packaging facility in Singapore adjacent to the company’s wafer fab there. The facility has a budget of…
Micron to spend US$2.2 billion to expand Virginia wafer fab
Micron to spend US$2.2 billion to expand Virginia wafer fab
News |
US memory chip manufacturer Micron Technology Inc. (Boise, Idaho) is planning to spend US$2.17 billion to expand and modernize its wafer fab at Manassas, Virginia. The project is set to…
Kioxia announces low-power, high density OCTRAM technology
Kioxia announces low-power, high density OCTRAM technology
Technology News |
OCTRAM technology delivers low-power, patterning extremely small features, and fully suppresses row hammer interference.
First complete memory interface for next generation DDR5 server MRDIMMs
First complete memory interface for next generation DDR5 server MRDIMMs
New Products |
Multiplexed registered clock driver, multiplexed data buffer and PMIC enables up to 12,800 MT/s for DDR5 AI and HPC applications.
SK Hynix prepares 16-layer HBM3e DRAM for 2025
SK Hynix prepares 16-layer HBM3e DRAM for 2025
New Products |
SK Hynix has announced that its 16-layer HBM3e DRAM will be available in 2025. The device is expected to sample in 1H25. The company’s CEO, Kwak Noh-Jung, announced the development…
Nvidia asks SK Hynix to supply HBM4 earlier
Nvidia asks SK Hynix to supply HBM4 earlier
News |
Nvidia CEO Jensen Huang has asked SK Hynix to supply the next generation of high-bandwidth memory (HBM) DRAMs six months earlier than previously planned due to high demand for AI…
SK Hynix scores record profits, doubles sales on AI demand
SK Hynix scores record profits, doubles sales on AI demand
Business news |
The leading position of SK Hynix Inc. (Seoul, South Korea) in high bandwidth memory (HBM) DRAM enabled the company to make a record net profit of about US$4.14 billion in…
Kioxia to detail emerging memory advances at IEDM 2024
Kioxia to detail emerging memory advances at IEDM 2024
Technology News |
Innovative DRAM, MRAM and 3D flash emerging memory technologies address future AI, computing and storage systems applications.
Samsung, TSMC team up on HBM4 DRAM
Samsung, TSMC team up on HBM4 DRAM
Business news |
Samsung and TSMC are teaming up to produce a bufferless high bandwidth memory (HBM) DRAM, according to The Korea Economic Daily, quoting Dan Kochpatcharin, head of ecosystem and alliance management…
16Gbit DDR5 DRAM made with 1c-nm process
16Gbit DDR5 DRAM made with 1c-nm process
Technology News |
SK Hynix has announced it has developed the worlds first 16Gbit DDR5 DRAM using its 1c node, the sixth generation of manufacturing processes between 20nm and 10nm. The 1c memory…
DRAM revenues surged in 2Q24
DRAM revenues surged in 2Q24
Market news |
DRAM sector revenues increased to US$22.9 billion in 2Q24, a 24.8 percent sequential rise, according to market analyst TrendForce. This surge was driven by expanded shipments of mainstream products that…
JEDEC preps finalization of HBM4 standard
JEDEC preps finalization of HBM4 standard
Technology News |
The JEDEC Solid State Technology Association has announced it is nearing completion of the next version of its High Bandwidth Memory (HBM) DRAM standard: HBM4. The HBM4 standard has been…
CXMT to invest US$2.35 billion in AI memory packaging fab
CXMT to invest US$2.35 billion in AI memory packaging fab
Business news |
Chinese DRAM maker ChangXin Memory Technologies Inc. (CXMT) is set to spend 17.1 billion yuan (about US$2.35 billion) to build an advanced packaging plant in Shanghai, according to Bloomberg. The…
DRAM revenues up while shipments decline
DRAM revenues up while shipments decline
Market news |
The DRAM sector revenues increased to US$18.35 billion in 1Q24, a 5.1 percent sequential rise, according to market analyst TrendForce. The revenue increase was driven by rising prices for mainstream…
Samsung develops 10.7 Gbps LPDDR5X DRAM optimized for AI
Samsung develops 10.7 Gbps LPDDR5X DRAM optimized for AI
New Products |
Industry-leading DRAM features come with 25% higher performance, 30% more capacity and 25% higher power efficiency.
DRAM prices set to climb 20% in 1Q24
DRAM prices set to climb 20% in 1Q24
Market news |
DRAM prices climbed in 4Q23 and are projected to show a further increase of near 20 percent in 1Q24, according to market analyst TrendForce. The firm states that the DRAM…
CES 2024: SK hynix to show leading memory products for AI
CES 2024: SK hynix to show leading memory products for AI
Technology News |
Company to solidify AI memory leadership with HBM3E memory that can process data up to 1.15 TB a second, and cut heat dissipation.
PCIe accelerator card cuts power consumption in AI servers
PCIe accelerator card cuts power consumption in AI servers
New Products |
The award-winning AI booster achieves over 10 times power-to-performance efficiency compared to GPUs.
First DDR5 client clock driver and RCD
First DDR5 client clock driver and RCD
New Products |
Registered clock driver and client clock driver ICs are first to support DDR5 server and client DIMM modules at peeds up to 6400 MT/s.
Startup Neo says its 3D DRAM offers 8x 2D capacity
Startup Neo says its 3D DRAM offers 8x 2D capacity
Technology News |
Neo Semiconductor Inc. (San Jose, Calif.) – a 2012 startup company – says it has developed a 3D technology that can increase DRAM capacity by a factor of eight. The…
Winbond to support chiplet interface standardisation
Winbond to support chiplet interface standardisation
Business news |
The UCIe Consortium open industry standard defines interconnect between chiplets within a package, enabling an open ecosystem.
  • 1
  • 2


10s