Accuracy boost for magnetic wafer probe
French test equipment developer Hprobe has demonstrated a 3D magnetic generator design with a magnetic field accuracy of less than 5µT (5 microteslas) for wafer level probing of 3D angular magnetic sensors.
The probe is designed to work with automated wafer probing stations and external electrical testers of the latest 3D magnetometers. The system presents high flexibility and compatibility with existing end-user platforms and high-volume manufacturing requirements.
This is the latest development of Hprobe’s patented 3D magnetic field generator technology for single and multi-site testing at wafer level, under a magnetic field.
“With this new achievement, we enable the implementation of new test strategies to improve test efficiency, allowing validation of more accurate sensor products,” said Siamak Salimy, CTO and co-founder of Hprobe. “Reaching 5µT thanks to Hprobe’s know-how and unique 3D magnetic field generator is only the beginning, and not at all the end of the capabilities of our technology.”
Automotive, consumer and industrial applications are using ever more powerful magnetic sensors to extract positioning, angular, strength and direction information. These sense physical parameters using a magnetic field and transmit electrical responses for further processing. To validate these sensors for end applications, they must be tested under extremely demanding and accurate 3D magnetic fields.
The 3D magnetic generator design can be integrated into the company’s existing equipment, which consists of a test head with a robotized 3D magnetic generator. It also includes a field calibration and monitoring system. It is built for interfacing with a currently available electrical tester or provided with a full tester as a turnkey solution. It comes with dedicated software for customers to implement their own tests and to generate custom 3D magnetic field patterns.
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