Chip firms are spending $500 billion on 84 wafer fabs
The global semiconductor industry will spend more than US$500 billion over many years in 84 wafer fabs starting construction between 2021 and 2023, says SEMI.
SEMI reckons 33 wafer fabs will start construction in 2022 and 28 in 2023
Demand for chips to go into high-performance computing, datacenters and automobiles is driving the increases, SEMI said.
Ajit Manocha, CEO of SEMI, said that government incentives around the world to expand production and strengthen supply chains was also having an impact. “With the bullish long-term outlook for the industry, rising investments in semiconductor manufacturing are critical to laying the groundwork for secular growth driven by a diverse range of emerging applications.”
China is set to outnumber all other regions with 20 facilities although these are supporting mature technologies
The Americas region will see 18 wafer fabs and semiconductor facilities start construction from 2021 through the end of 2023.
Europe and the Middle-East will start construction of 17 fabs between 2021 and 2023.
Taiwan‘s new facility count is 14 while Japan and the Southeast Asia are expected to begin building six facilities each over the forecast period.
South Korea is forecast to start construction on three large facilities.
Related links and articles:
News articles:
Chipmaking equipment sales to slip in 2023
Semi launches sustainability consortium
SEMI Europe urges haste with European Chips Act
‘Onshoring’ chip production in US, Europe is unrealistic
European Commission forms processor, semiconductor alliance
If you enjoyed this article, you will like the following ones: don't miss them by subscribing to :
