System in Package for the STM32MP2 embedded AI processor
Octavo Systems has launched two system in package devices using a multicore embedded AI processor from STMicroelectronics.
The Octavo OSD32MP2 family consists of two System-in-Package (SiP) modules: the OSD32MP2 and OSD32MP2-PM.
The OSD32MP2 SiP module integrates the STM32MP2 processor, DDR4 memory, power management (STMPMIC2), EEPROM, oscillators, and passives into a 21mm x 21mm BGA package. The STM32MP25 has two ARM Cortex-A35 cores, an ARM Cortex-M33 core, a 3D GPU supporting Vulkan API, H.264 video encoding/decoding, a 1.35 TOPS AI accelerator, and comprehensive connectivity options.
The OSD32MP2-PM is a streamlined module focusing on the essential integration of the STM32MP2 processor and DDR4 memory in a compact 9mm x 14mm package, ideal for cost-sensitive or uniquely designed projects requiring flexibility in power solutions or form factors.
“Octavo Systems is committed to empowering electronics design engineers by simplifying the complexities of modern electronic design,” said Harley Walsh, President of Octavo Systems. “Our OSD32MP2 series allows engineers to focus on innovation and product differentiation, providing them with the tools to bring their ideas to market faster and more efficiently than ever before.”
The OSD32MP2 reduces design time and size by up to 60%, offering the lowest total cost of ownership. The OSD32MP2-PM offers a flexible option for designs requiring a unique form factor or power solution, making it ideal for wearable technology or other innovative applications.
Samples of the OSD32MP2-PM will be available at the end of 2024, with the OSD32MP2 samples following in early 2025.
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