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Boards & Embedded Cards Page 12

Boards & Embedded Cards Page 12
BittWare launches partner programme for FPGA designs
BittWare launches partner programme for FPGA designs
Business news |
FPGA accelerator developer Bittware has launched a partner program designed to simplify and streamline deployment of applications across computing, networks…
China’s chip output falls due to Covid lockdowns
China’s chip output falls due to Covid lockdowns
Market news |
China’s production of ICs fell in March by 5.1 percent year-on-year to 28.5 billion units, according to data released by…
Raspberry Pi warns of bots as supply still tight
Raspberry Pi warns of bots as supply still tight
Business news |
Raspberry Pi is continuing to see short supply of its single board computers, prioritising industrial customers and pointing other customers…
Intel, ADI in US chip alliance
Intel, ADI in US chip alliance
Business news |
Three leading US chip manufacturers have joined Mitre Engenuity’s semiconductor alliance with the aim of bolstering the resilience of the…

Intel, Micron, Analog Devices form US chip alliance
Intel, Micron, Analog Devices form US chip alliance
Business news |
Intel, Micro and Analog Devices – three leading US chip manufacturers – have joined Mitre Engenuity’s semiconductor alliance with the aim of bolstering the resilience of the US semiconductor industry.
Smart building reference design combines edge AI, privacy
Smart building reference design combines edge AI, privacy
New Products |
Optical and photonic products manufacturer Lumentum and AI vision processor specialist Ambarella have announced a new joint reference design that uniquely combines edge artificial intelligence (AI) with privacy, enabling new…
World’s smallest 16 core ARM module
World’s smallest 16 core ARM module
New Products |
SolidRun in Israel has developed a series of System on Module (SOM) designs using 16 core ARM processors from NXP Semiconductors. The family of LX2-Lite SOMs and Clearfog LX2-Lite Development Platform…
Open source Snapdragon baseboard targets AI
Open source Snapdragon baseboard targets AI
New Products |
Antmicro has created an open source Snapdragon 845 Baseboard for vision-based machine learning designs. The open hardware baseboard serves as a starting point for building new solutions such as portable…
Compact controller suits range of IoT applications
Compact controller suits range of IoT applications
New Products |
Robotics maker and open source hardware provider DFRobot has announced a new controller that is offered as ideal for IoT applications.
First G.hn powerline embedded module for Industrial IoT
First G.hn powerline embedded module for Industrial IoT
New Products |
The HomeGrid Forum has certified its first G.hn system on module (SOM) for Industrial Internet of Things (IIoT) applications communicating over powerlines. The certification of the GHN.SOM.PLC module from Teleconnect in Dresden…
Edge AI eval kit kickstarts AI vision, sensor fusion for IoT apps
Edge AI eval kit kickstarts AI vision, sensor fusion for IoT apps
New Products |
Human interface hardware and software developer Synaptics has announced an Edge AI evaluation kit (EVK) for the rapid development and prototyping of artificial intelligence (AI) applications at the edge.
RISC-V reference design for Intel FPGA module
RISC-V reference design for Intel FPGA module
Technology News |
Aries Embedded in Germany has developed a RISC-V reference IP design for its Intel-based FPGA module. The MCXL system on module (SoM) is based on the Intel Cyclone 10 LP…
Vehicle computing platforms enable smart mobility
Vehicle computing platforms enable smart mobility
New Products |
With new vehicle computing platforms, Congatec offers the hardware infrastructure to advance digitalisation and autonomous driving in harsh environments. The board computers with an extended temperature range are intended for…
Arm Linux Arduino SoM for edge AI, real-time industrial apps
Arm Linux Arduino SoM for edge AI, real-time industrial apps
New Products |
Open-source electronic prototyping platform Arduino has announced an industrial-grade system on module (SOM) with Linux OS preloaded onboard.
Arduino launches nine core module for edge AI
Arduino launches nine core module for edge AI
Technology News |
Arduino has launched a nine core system-on-module (SoM) with industrial support for edge AI, its first to use ARM’s Cortex-A applications processor. The Portenta X8 SoM measures 66.04 x 25.40…
Foxconn mulls $9 billion chips and components factory for Saudi Arabia
Foxconn mulls $9 billion chips and components factory for Saudi Arabia
Business news |
Saudi Arabia is reviewing an offer from Foxconn Technology Group to build a $9 billion factory that could make ICs and electric vehicle components, according to the Wall Street Journal.
2MP standalone camera analyzes, processes images on the edge
2MP standalone camera analyzes, processes images on the edge
New Products |
Open-source hardware and software company Arduino has introduced a ready-to-use, 2MP standalone camera that lets users analyze and process images on the edge for advanced machine vision and edge computing…
Foundry market to grow 20 percent in 2022
Foundry market to grow 20 percent in 2022
Market news |
The foundry market is set to achieve a third year of 20 percent growth in 2022, according to IC Insights. After dropping 2 percent in 2019, the foundry market logged…
US plans to make China comply with Russian chip sanctions
US plans to make China comply with Russian chip sanctions
Business news |
US Commerce Secretary Gina Raimondo has re-iterated that the US will enforce Chinese compliance with chip sanctions against Russia, according to Bloomberg. “I’m not going to pretend it won’t be…
Congatec, SIE team for COM HPC tech
Congatec, SIE team for COM HPC tech
Business news |
Board maker congatec has teamed up with systems integrator System Industrie Electronic GmbH (S.I.E) on platforms for regulated industries, such as healthcare and medical technology and cybersecurity. SIE in Lustenau,…
Top ten articles on eeNews Analog in February 2022
Top ten articles on eeNews Analog in February 2022
Feature articles |
Below are the top ten articles in February 2022 by readership on eenewsanalog.com In case you missed any of these here they are in reverse order: 10 Arm’s China…
SparkFun, MikroElektronika expand rapid prototyping offerings
SparkFun, MikroElektronika expand rapid prototyping offerings
New Products |
Electronics retailer SparkFun Electronics and embedded system development tools maker MikroElektronika have partnered to create two new boards that merge their combined rapid prototyping ecosystems.
3U OpenVPX Cube development enclosure
3U OpenVPX Cube development enclosure
New Products |
Pixus Technologies has launched a a small form factor enclosure for development and demonstration of 3U OpenVPX systems. The OpenVPX Cube Chassis is 4U tall and 42HP (8.4in) wide and…
Analog Devices to invest €100 million in Limerick R&D centre
Analog Devices to invest €100 million in Limerick R&D centre
Business news |
Mixed-signal to RF chip maker Analog Devices Inc. has announced it will invest €100 million (about US$110 million) in a development centre in Limerick. The investment in ADI Catalyst –…
Americas’ chip market growth goes above 40%
Americas’ chip market growth goes above 40%
Market news |
In January the Americas market for semiconductors was 40.2 percent higher than a year before on a three-month average basis, according to the US Semiconductor Industry Association. This phenomenal regional…
MikroElektronika, SparkFun team for rapid prototyping
MikroElektronika, SparkFun team for rapid prototyping
Business news |
European board maker MikroElektronika (MikroE) has teamed up with SparkFun Electronics in the US on two new boards that merge their combined rapid prototyping ecosystems The SparkFun RP2040 mikroBUS Development…
UCIe chiplet standard created by industry leaders
UCIe chiplet standard created by industry leaders
Technology News |
A group of ten of the most important technology companies has announced the Universal Chiplet Interconnect Express (UCIe) technology. The proposers claim the existence of UCIe will establish the framework…
3D packaging drives $11.9 billion capex
3D packaging drives $11.9 billion capex
Market news |
Leading companies’ capital expenditure on high-performance packaging was about US$11.9 billion in 2021, according to Yole Developpement (Lyon, France). And this is intended help those companies serve a market for…


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