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Boards & Embedded Cards Page 5

Boards & Embedded Cards Page 5
Foxconn shakes off factory disruption as January sales jump
Foxconn shakes off factory disruption as January sales jump
Business news |
Electronics assembly company Hon Hai Precision Industries, which trades as Foxconn, achieved record sales in January of NT$660.4 billion (about…
OKdo launches Rock5A board for edge AI
OKdo launches Rock5A board for edge AI
New Products |
Board manufacturer OKdo has launched the latest version of its Rock single board computer developed with Radxa. The more affordable…
ST launches dedicated microcontroller edge AI cloud farm
ST launches dedicated microcontroller edge AI cloud farm
Technology News |
STMicroelectronics has launched a dedicated cloud service for edge AI applications using its microcontrollers and boards. The STM32Cube.AI Developer Cloud…
Intel kills its RISC-V Pathfinder development kit programme
Intel kills its RISC-V Pathfinder development kit programme
Business news |
Intel has discontinued its recent programme that brought together a wide range of RISC-V technologies. The Pathfinder programme includes…

Vulnerabilities in PMbus can brick server boards
Vulnerabilities in PMbus can brick server boards
Technology News |
Researchers in the UK have identified vulnerabilities in the power management bus (PMbus) for processors that can disable server boards. The vulnerability, dubbed PMFault, was discovered by Zitai Chen and…
Kontron buys Spanish public transportation business
Kontron buys Spanish public transportation business
Business news |
Kontron has completed the acquisition of the Spanish public transportation technology business of Vienna-based Kapsch TrafficCom. The Arce Mobility Solutions business has now been incorporated into the Kontron Transportation Group,…
Italy launches its first data centre association
Italy launches its first data centre association
Business news |
The Italian Data Centre Association (IDA) is the first Italian association of data centre developers and operators, and aims to create a common platform for the industry. The association aims…
i.MX93 System on Module targets edge AI
i.MX93 System on Module targets edge AI
New Products |
Variscite in Israel has developed a system on module (SoM) for efficient machine learning on edge devices using the NXP i.MX93 controller. The VAR-SOM-MX93 is the industry’s first implementation of…
Open source baseboard targets latest Nvidia Orin module
Open source baseboard targets latest Nvidia Orin module
New Products |
Antmicro in Stockholm, Sweden, has developed an open source design of a baseboard for the latest Nvidia Jetson Orin NX module. The compact size of the open hardware boards is…
$50,000 prize in Single Board Computer competition
$50,000 prize in Single Board Computer competition
Business news |
Board distributor OKdo has launched an engineering competition around the Rock single board computer (SBC) with a prize of $50,000 (€50,000). The Rock Engineering Challenge invites engineers, developers, educators, inventors…
3U OpenVPX Single Board Computer uses Xeon W
3U OpenVPX Single Board Computer uses Xeon W
New Products |
Interface Concept in France has developed a 3U OpenVPX single board computer based on the 11th Gen Intel Xeon W processor, formerly known as Tiger Lake-H. The IC-INT-VPX3k provides the…
Aries, Emdalo team on RISC-V FPGA module
Aries, Emdalo team on RISC-V FPGA module
Business news |
Aries Embedded in Germany has teamed up with Emdalo Technologies in Ireland to develop embedded modules based on Microchip’s PolarFire RISC-V SoC and FPGA architecture. Aries has used the PolarFire…
COM-HPC boards with Intel 13th Gen processors target IoT
COM-HPC boards with Intel 13th Gen processors target IoT
New Products |
Kontron has launched two COM-HPC boards using Intel’s 13th Gen Core Raptor Lake U/P/H and Raptor Lake-S mobile and desktop processors. The COMh-caRP and COMh-ccAS provide 14 cores up to…
OKdo, OStream team on edge AI supercomputers
OKdo, OStream team on edge AI supercomputers
Business news |
Board distributor OKdo has licensed streaming software that runs AI video and audio processing at the edge of the network on a range of hardware in a significant shift to…
Gigabyte splits into two
Gigabyte splits into two
Business news |
Taiwanese motherboard maker Gigabyte Technology has spun out its enterprise business, splitting the company into two. The move, announced at CES 2023 in the US, will see Giga Computing…
Canon fields lithography stepper for 3D packaging
Canon fields lithography stepper for 3D packaging
Technology News |
Canon Inc. has launched an i-line lithography stepper for use in 3D advanced packaging such as those used with chiplets mounted on an interposer. The FPA-5520iV LF2, based on 365nm…
13th gen COM modules for the IoT use BGA
13th gen COM modules for the IoT use BGA
New Products |
congatec has launched ranges of COM-HPC and COM Express Computer-on-Modules based on high-end 13th Gen Intel Core processors in ball grid array (BGA) assembly. congatec expects series production of OEM…
Axelera launches RISC-V AI platform for edge vision
Axelera launches RISC-V AI platform for edge vision
Business news |
Dutch chip startup Axelera AI has launched a platform that combines its Metis AI Processing Unit (AIPU) chip, RISC-V controller and Voyager SDK software stack. The Metis platform is available as embedded cards, boards and…
Development chassis mixes OpenVPX and VME64x backplanes
Development chassis mixes OpenVPX and VME64x backplanes
New Products |
Pixus Technologies has launched an open frame development chassis with multiple configuration options using both VME64 and OpenVPX backplanes. The chassis allows standard VITA 65 profile and power and ground…
Picocom in 5G Open RAN board deal
Picocom in 5G Open RAN board deal
Business news |
Picocom in Bristol has signed a key deal for its silicon in Open RAN 5G radio units and to distribute its boards. The partnership with Accton Technology Group in Taiwan…
Texas Instruments’ Lehi wafer fab starts production
Texas Instruments’ Lehi wafer fab starts production
Business news |
LFAB, Texas Instruments’ 300mm wafer fab in Lehi, Utah, has started production a year after its acquisition from Micron Technology Inc. LFAB is TI’s second 300mm wafer fab to start…
Mini pinout for COM-HPC standard
Mini pinout for COM-HPC standard
Technology News |
The PICMG standards group has agreed a pinout for a smaller version of the COM-HPC high performance computer on module. The COM-HPC Mini measures 60 x 95 mm for embedded…
Learning edge AI chip slashes power for the IoT
Learning edge AI chip slashes power for the IoT
Technology News |
Rohm has developed a low power edge AI processor that includes learning as well as inference for predictive maintenance in the Internet of Things (IoT) The prototype BD15035 AI chip…
Functional safety boost for COM-HPC
Functional safety boost for COM-HPC
Technology News |
The COM-HPC high performance embedded board specification has been boosted with extensions for functional safety. PICMG, the consortium that oversees the development of open embedded computing specifications, has ratified the…
OpenVPX backplane tops 100GbE
OpenVPX backplane tops 100GbE
News |
Pixus Technologies has developed a high performance OpenVPX backplane with signals above 28 Gbaud across the backplane slots. The design leverages the 6U OpenVPX form factor and VITA 66/67 RF…
Nitrate sensing reference design for UV-C LEDs
Nitrate sensing reference design for UV-C LEDs
New Products |
Ultraviolet UV-C LEDs from Silanna UV are being used in a reference design for sensing nitrates in drinking water. The SF1 series of LEDs use the company’s patented short period superlattice…
Congatec boosts TSN for smart factories
Congatec boosts TSN for smart factories
Business news |
German board maker congatec has launched an ecosystem for time sensitive networking (TSN) in networked factories and critical infrastructures. The combination of edge computing boards and software aims to simplify…
COM Express adds high speed serial support for USB4, PCIe4.0
COM Express adds high speed serial support for USB4, PCIe4.0
Technology News |
PICMG has updated the COM Express specification to support high-speed serial interfaces such as PCIe Gen 4 and USB4. The interfaces supported by COM Express 3.1 will boost its role…


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